Bondexpo 2026

Bondexpo is the international trade fair for adhesive bonding technology, organised by P. E. Schall at Messe Stuttgart. The 18th edition covers the whole bonding process chain, from adhesives and surface pre-treatment to dispensing, curing and testing, for engineers and production managers who join, seal and pot components.

What's covered

The exhibition follows the joining process step by step.

• Adhesives and sealants
• Dispensing and application systems
• Potting and foaming
• Surface pre-treatment and curing
• Quality assurance and testing

Co-located with Motek

Bondexpo runs at the same time as the 43rd Motek, the international trade fair for production and assembly automation, in the neighbouring halls. According to the organiser, one ticket admits visitors to all the trade fairs held in parallel at the Stuttgart exhibition centre.

Who visits

Design, production and process engineers, and buyers from automotive, electronics, mechanical engineering, medical technology and other manufacturing sectors.

Tickets & passes

• Day ticket — EUR 35: Admission for one person on one day
• Reduced day ticket — EUR 28: Ages 9–17, pupils, students, pensioners and other entitled visitors with ID