When is Bondexpo 2026 and what are the hours?

6 to 8 October 2026, 09:00 to 17:00 daily.

How much is a ticket?

A day ticket costs EUR 35. A reduced day ticket for 9 to 17 year olds, pupils, students, pensioners and other entitled visitors with ID costs EUR 28. Children up to 8 enter free.

Which other fairs can I visit with the same ticket?

Bondexpo runs alongside Motek, the trade fair for production and assembly automation, and the ticket covers the parallel fairs at Messe Stuttgart.

At Messe Stuttgart, next to Stuttgart Airport.

Bondexpo 2026

Name: Bondexpo 2026
Start: 2026-10-06T09:00:00+00:00
End: 2026-10-08T17:00:00+00:00
Location: Messe Stuttgart

About this event

Bondexpo is the international trade fair for adhesive bonding technology, organised by P. E. Schall at Messe Stuttgart. The 18th edition covers the whole bonding process chain, from adhesives and surface pre-treatment to dispensing, curing and testing, for engineers and production managers who join, seal and pot components.

What's covered

The exhibition follows the joining process step by step.

Adhesives and sealants
Dispensing and application systems
Potting and foaming
Surface pre-treatment and curing
Quality assurance and testing

Co-located with Motek

Bondexpo runs at the same time as the 43rd Motek, the international trade fair for production and assembly automation, in the neighbouring halls. According to the organiser, one ticket admits visitors to all the trade fairs held in parallel at the Stuttgart exhibition centre.

Who visits

Design, production and process engineers, and buyers from automotive, electronics, mechanical engineering, medical technology and other manufacturing sectors.

Tickets & passes

Day ticket — EUR 35: Admission for one person on one day
Reduced day ticket — EUR 28: Ages 9–17, pupils, students, pensioners and other entitled visitors with ID

Bondexpo 2026 was an Industry & Manufacturing event that took place 6-8 Oct 2026 at Messe Stuttgart, Stuttgart, Germany.

Event recap

The 18th Bondexpo, the international trade fair for adhesive technology, took place from 6 to 8 October 2026 at Messe Stuttgart, organized by P. E. Schall. It shared Hall 6 with the 43rd Motek for production and assembly automation, the first joint edition since both fairs moved to a two-year rhythm, and 152 exhibitors were listed for the combined show. The same ticket gave access to VISION, EFX and Quantum Effects in the neighbouring halls, linking bonding technology with automation, machine vision and electronics manufacturing. The 19th Bondexpo is scheduled with Motek for 24–26 October 2028 in Stuttgart.