SEMICON Taiwan 2027

SEMICON Taiwan, organised by the global industry association SEMI, gathers the full semiconductor ecosystem in Taipei: IC design, wafer manufacturing, packaging and testing, equipment and materials. The 2027 edition moves to 18-20 August, about three weeks earlier than its usual September slot, so that SEMI can secure enough space across multiple halls for a show that keeps growing with AI-driven demand.

Exhibition

The 2026 show set records for exhibitors and booths. Its largest areas were the high-tech smart manufacturing zone and the advanced packaging technology zone, and new areas for quantum technology, wafer manufacturing and chiplets were added, with silicon photonics and co-packaged optics a major focus.

Forums and programme

Alongside the exhibition SEMI runs a dense forum programme. In 2026 more than 50 forums with 350 speakers drew over 11,000 attendees, led by an all-day executive summit covering the AI value chain, plus 120 on-site product launches.

• CEO and executive summits
• Advanced packaging and heterogeneous integration
• Silicon photonics and CPO
• Smart manufacturing
• Sustainability and cybersecurity
• Talent and start-up programmes

Who attends

Engineers, procurement teams and executives from chipmakers, foundries, OSATs, equipment and materials suppliers, EDA and IP vendors, plus investors, researchers and students.