
Industrial Engineering · Conference
Chiplet Summit 2027
Conference and exhibition on chiplet-based design, advanced packaging and die-to-die interfaces for chip engineers.
30 March – 1 April 2027 · Tue – Thu
Santa Clara Convention Center · Santa Clara, United States
Registration open · on www.chipletsummit.com
About this event
Chiplet Summit is a Silicon Valley conference and exhibition dedicated to chiplets, the approach of building processors and accelerators from several smaller dies in one package. Under the tagline "All the Solutions for Developing Chiplets", it gathers chip architects, design and packaging engineers, foundries, EDA and IP vendors and system builders at the Santa Clara Convention Center.
What's covered
Recent programs have focused on the building blocks of a chiplet ecosystem, from interfaces between dies to packaging and working with foundries.
- AI/ML acceleration
- The open chiplet economy
- Advanced packaging methods
- Die-to-die interfaces
- Working with foundries
Exhibition
Alongside keynotes, technical sessions and tutorials, an exhibition hall lets attendees meet suppliers of chiplet IP, EDA tools, packaging and test services; 2027 floor plans, sponsor and exhibitor packages are already published.
Chiplet Summit 2027 is an Industrial Engineering event taking place 30 Mar - 1 Apr 2027 at Santa Clara Convention Center, Santa Clara, United States.
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Location
Santa Clara Convention Center
5001 Great America Pkwy California 95054, Santa Clara, United States
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About this listing
Details are collected from the organizer’s official site, www.chipletsummit.com. Last verified .
30 March – 1 April 2027
Chiplet Summit 2027












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